~ table of contents ~ .
Introduction, see more…
Failure Analysis Approach
Problem Statement
Verify and Characterize the Failure
Failure Analysis Procedures
Yield Reduction Mechanisms
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DesiDesign
Pro Process
Metal Etch Polymer
Example: Corrosion Cotton Balls
Oxide Etch Polymer
Example #1: Open Vias
Example #2: Onion Rings
Stringers
Example #1: Residual Material In Crevices
Example #2: Material Trapped Under Ledge
Example #3: Residual Poly 2 Causes High Leff
Test
Assembly
Electrical Fault Localization
Semiconductor Test Parametrics (Test Structures)
Test Binning
Curve Tracer
IDD, IDDQ
Shmoo Plotting
Loop on Problem Vectors
Physical Fault Localization
Mechanical Probing
Liquid Crystal Hot Spot Detection
Purpose
Theory
Device Failure Characteristics
Equipment
Hot Spot Detection Procedure
Liquid Crystal Application – A Final Result
Procedure Variations
Emission Microscopy
SEM Techniques
High Energy Passive Voltage Contrast
Sample Preparation Techniques
Non-encapsulated Cross Section Basics
Purpose
Background and Theory
Equipment
Procedure
General Comments
Wet Etch Passivation Removal
Example #1: A Construction Overview
Example #2: Isolation of Circuit Elements
Analytical Techniques / Contract Services
Energy Dispersive Spectroscopy (EDS)
Wavelength Dispersive Spectroscopy (WDS)
Auger Electron Spectroscopy (AES)
Secondary Ion Mass Spectrometry (SIMS)
Fourier Transfer Infrared Spectrometry (FTIR)
X-ray Photoelectron Spectroscopy (XPS)
X-ray Fluorescence (XRF)
Rutherford Backscattering Spectroscopy (RBS)
Scanning Tunneling Microscopy (STM)
Scanning Probe Microscopy (SPM)
Equipment Considerations – In house / Off site
Appendices
Glossary
Resources
Accelerated Analysis
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DavidBurgess@AcceleratedAnalysis.com
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