This tutorial is offered as a reference for failure analysis of semiconductor products.

Material is selected from the book, Wafer Failure Analysis for Yield Enhancement, by Dave Burgess and Dick Blanchard, with contributions by Joe Gajda.  The purpose of this book, no longer in print, is to show how a small, affordable subset of failure analysis tools can speed process development and improve yields.

Material will be added from time to time.  Your comments and suggestions are welcome and will shape the content of this tutorial section.


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