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table of contents
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abridged
Failure Analysis Approach
Problem Statement
Verify and Characterize the Failure
Failure Analysis Procedures
Yield Reduction Mechanisms
| Design | |
| Process |
Metal Etch Polymer
Example: Corrosion Cotton Balls
Example #1: Open Vias
Example #2: Onion RingsExample #1: Residual Material In Crevices
Example #2: Material Trapped Under Ledge
Example #3: Residual Poly 2 Causes High Leff
| Test | |
| Assembly |
Electrical Fault Localization
Semiconductor Test Parametrics (Test Structures)
Test Binning
Curve Tracer
IDD, IDDQ
Shmoo Plotting
Loop on Problem Vectors
Physical Fault Localization
Mechanical Probing
Liquid Crystal Hot Spot DetectionPurpose
Theory
Device Failure Characteristics
Equipment
Hot Spot Detection Procedure
Liquid Crystal Application - A Final Result
Procedure VariationsEmission Microscopy
SEM Techniques
Sample Preparation Techniques
Non-encapsulated Cross Section Basics
Purpose
Background and Theory
Equipment
Procedure
General CommentsWet Etch Passivation Removal
Example #1: A Construction Overview
Example #2: Isolation of Circuit Elements
Analytical Techniques / Contract Services
Energy Dispersive Spectroscopy (EDS)
Wavelength Dispersive Spectroscopy (WDS)
Auger Electron Spectroscopy (AES)
Secondary Ion Mass Spectrometry (SIMS)
Fourier Transfer Infrared Spectrometry (FTIR)
X-ray Photoelectron Spectroscopy (XPS)
X-ray Fluorescence (XRF)
Rutherford Backscattering Spectroscopy (RBS)
Scanning Tunneling Microscopy (STM)
Scanning Probe Microscopy (SPM)
Equipment Considerations - In house / Off site
Appendices
Resources
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Comments, suggestions, and corrections/omissions concerning this material are encouraged and will be appreciated. Your input will make a difference in the development of the content of this new book, Wafer Failure Analysis for Yield Enhancement.
Contact David Burgess:
Email: davidburgess@AcceleratedAnalysis.com
Phone: (650) 867-8443 or (650) 726-1832
Fax: (408) 241-0547
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